Exploited· due 2023-12-26
CVE-2023-33063
Qualcomm Multiple Chipsets
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Exploitation status
- CISA has confirmed this is being exploited in the wild. That is an observation of real attacks, not a prediction.
- US federal civilian agencies are required to remediate it by 2023-12-26. That deadline does not bind private companies, but it is a reasonable benchmark for how urgently CISA views it.
Required action
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
CISA’s wording, unedited.
Scoring
- CVSS
- Not yet scored
Dates
- Published
- 2023-12-05
- Added to KEV
- 2023-12-05
- Remediation due
- 2023-12-26
- Sources
- CISA KEV